Thermal Accumulation in Low-Conductivity Polymers
Thermal Conductivity Impact on Marking
Critical Physics Relationship
When optical penetration depth exceeds the thermal damage threshold depth, foaming becomes inevitable. The relationship is:
Foaming Risk = δ / (k × τ)
Where δ = penetration depth, k = thermal conductivity, τ = pulse duration
High risk values indicate the need for physics optimization to achieve clean marking.

